Electronic Packaging Materials and Their Properties Book Reviews
Electronic Packaging Materials and Their Properties by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan Book Summary
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
interconnections
printed circuit boards
substrates
encapsulants
dielectrics
die attach materials
electrical contacts
thermal materials
solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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| Book Name | Electronic Packaging Materials and Their Properties |
| Genre | Electrical Engineering |
| Author | Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan |
| Published | 19 December 2017, Tuesday |
| Language | English |
| E-Book Size | 9.53 MB |
Electronic Packaging Materials and Their Properties (Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan) Book Reviews 2024
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| electronic-packaging-materials-and-their-ebook.pdf | |
| electronic-packaging-materials-and-their-ebook.epub | EPUB |
| electronic-packaging-materials-and-their-ebook.kindle | KINDLE |
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Summary of Electronic Packaging Materials and Their Properties by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan
The Electronic Packaging Materials and Their Properties book written by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour & Rahul Mahajan was published on 19 December 2017, Tuesday in the Electrical Engineering category. A total of 174 readers of the book gave the book 0 points out of 5.
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