Characterization of Integrated Circuit Packaging Materials Book Reviews
Characterization of Integrated Circuit Packaging Materials by Thomas Moore Book Summary
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems. Readers will find: -- General overview of IC package reliability testing -- Characterization for the electrical performance of IC packages -- Understanding surface characteristics and interfaces for thermal management -- Concise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more.
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| Book Name | Characterization of Integrated Circuit Packaging Materials |
| Genre | Engineering |
| Author | Thomas Moore |
| Published | 01 March 2010, Monday |
| Language | English |
| E-Book Size | 12.79 MB |
Characterization of Integrated Circuit Packaging Materials (Thomas Moore) Book Reviews 2024
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| Download Link | Book Format |
| characterization-of-integrated-circuit-p-ebook.pdf | |
| characterization-of-integrated-circuit-p-ebook.epub | EPUB |
| characterization-of-integrated-circuit-p-ebook.kindle | KINDLE |
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Summary of Characterization of Integrated Circuit Packaging Materials by Thomas Moore
The Characterization of Integrated Circuit Packaging Materials book written by Thomas Moore was published on 01 March 2010, Monday in the Engineering category. A total of 184 readers of the book gave the book 0 points out of 5.
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